Thermally Conductive, Flowable Epoxy Meets NASA Low Outgassing Specifications

Master Bond (Hackensack, NJ) has launched EP53TC, a two-component epoxy designed for bonding, sealing, coating, and small potting applications where efficient heat dissipation is crucial. The epoxy is formulated with a specialty filler with a particle size ranging from 5 to 30 microns. It is a flowable system with a mixed viscosity of 45,000-65,000 cps at room temperature. This filler size and its relatively flowable viscosity enable the EP53TC epoxy to fill small voids making it ideal for heat dissipation. Specifically:

• EP53TC meets ASTM E595 NASA low outgassing specifications and provides reliable electrical insulation with a volume resistivity greater than 1014 ohm-cm.
• This epoxy exhibits dimensional stability with low shrinkage upon curing and a low coefficient of thermal expansion of 14-16 x 10-6 in/in/°C. 
• Mechanical properties include a tensile strength of 5,000 to 7,000 psi, a tensile modulus greater than 1,000,000 psi, and a Shore D hardness of 85-95. 
• The service temperature range is from -100ºF to +300ºF (-73ºC to +149ºC).

A moderate heat cure is required to achieve optimal properties with EP53TC. The recommended cure schedule is 2 hours at 80ºC followed by a post-cure of 90-120 minutes at 125ºC. This epoxy is available in various packaging options, including ounce kits, quarter pint kits, half pint kits, pint kits and quart kits.